5962-8984111KX vs 5962-8984105KA feature comparison

5962-8984111KX QP Semiconductor

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5962-8984105KA AMD

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC ADVANCED MICRO DEVICES INC
Package Description DFP, DFP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 50 MHz 50 MHz
JESD-30 Code R-GDFP-F24 R-GDFP-F24
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Programmable Logic Type FLASH PLD EE PLD
Propagation Delay 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Base Number Matches 3 4
Part Package Code DFP
Pin Count 24
Additional Feature VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
Architecture PAL-TYPE
JESD-609 Code e0
Length 15.367 mm
Package Equivalence Code FL24,.4
Screening Level MIL-PRF-38535; MIL-STD-883
Seated Height-Max 2.286 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 10.29 mm

Compare 5962-8984111KX with alternatives

Compare 5962-8984105KA with alternatives