5962-8984107LA vs 5962-8605305KA feature comparison

5962-8984107LA Cypress Semiconductor

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5962-8605305KA AMD

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DFP
Package Description CERAMIC, DIP-24 DFP, FL24,.4
Pin Count 24 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 30.3 MHz 50 MHz
JESD-30 Code R-GDIP-T24 R-GDFP-F24
JESD-609 Code e0 e0
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Inputs 22 22
Number of Outputs 10 10
Number of Product Terms 132 132
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Equivalence Code DIP24,.3 FL24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Programmable Logic Type FLASH PLD OT PLD
Propagation Delay 25 ns 15 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS TTL
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Additional Feature VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
Length 15.367 mm
Seated Height-Max 2.286 mm
Width 10.29 mm

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