5962-8984106KB
vs
5962-8984106KA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TELEDYNE E2V (UK) LTD
Part Package Code
DFP
Package Description
DFP,
CERAMIC, DFP-24
Pin Count
24
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
IT ALSO AVAILABLE IN GDFP-24 PACKAGE, CORRECT SUBGROUP EEPLD
Clock Frequency-Max
76.9 MHz
76.9 MHz
JESD-30 Code
R-GDFP-F24
R-CDFP-F24
JESD-609 Code
e0
e0
Length
15.367 mm
15.367 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Equivalence Code
FL24,.4
FL24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Qualified
Seated Height-Max
2.286 mm
2.286 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
9.652 mm
9.652 mm
Base Number Matches
1
3
Architecture
PAL-TYPE
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Screening Level
MIL-STD-883
Compare 5962-8984106KB with alternatives
Compare 5962-8984106KA with alternatives