5962-8984104LA
vs
GAL22V10D-25LPNI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-24
LEAD FREE, PLASTIC, DIP-24
Pin Count
24
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
10 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; SHARED INPUT/CLOCK
10 MACROCELLS; SHARED INPUT/CLOCK
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
26.3 MHz
33.3 MHz
JESD-30 Code
R-GDIP-T24
R-PDIP-T24
Length
31.875 mm
31.75 mm
Moisture Sensitivity Level
1
1
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
22
Number of Outputs
10
10
Number of Product Terms
132
132
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.334 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Samacsys Manufacturer
Lattice Semiconductor
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-8984104LA with alternatives
Compare GAL22V10D-25LPNI with alternatives