5962-8984104LA
vs
5962-8753901KX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DFP
Package Description
DIP,
WDFP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
Clock Frequency-Max
26.3 MHz
30.3 MHz
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
JESD-609 Code
e0
Length
31.9405 mm
15.45 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK, WINDOW
Programmable Logic Type
EE PLD
UV PLD
Propagation Delay
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.41 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
9.6 mm
Base Number Matches
1
1
Package Equivalence Code
FL24,.4
Compare 5962-8984104LA with alternatives
Compare 5962-8753901KX with alternatives