5962-8984102LX
vs
5962-8984105LX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
Clock Frequency-Max
31.2 MHz
50 MHz
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
20 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Package Equivalence Code
DIP24,.3
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-8984102LX with alternatives
Compare 5962-8984105LX with alternatives