5962-8984102LX
vs
5962-8984101KA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DFP
Package Description
DIP,
DFP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
Clock Frequency-Max
31.2 MHz
25 MHz
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
20 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Additional Feature
VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
JESD-609 Code
e0
Length
15.367 mm
Package Equivalence Code
FL24,.4
Seated Height-Max
2.286 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
10.29 mm
Compare 5962-8984102LX with alternatives
Compare 5962-8984101KA with alternatives