5962-8984102LA
vs
5962-8767101KA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
Package Description
CERAMIC, DIP-24
DFP,
Pin Count
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
Clock Frequency-Max
31.2 MHz
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
JESD-609 Code
e0
e0
Number of Dedicated Inputs
11
14
Number of I/O Lines
10
6
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
14 DEDICATED INPUTS, 6 I/O
Output Function
MACROCELL
COMBINATORIAL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Equivalence Code
DIP24,.3
FL24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Programmable Logic Type
EE PLD
OT PLD
Propagation Delay
20 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Additional Feature
POWER-UP RESET
Length
15.367 mm
Seated Height-Max
2.286 mm
Width
10.29 mm
Compare 5962-8984102LA with alternatives
Compare 5962-8767101KA with alternatives