5962-89841013X vs 5962-8872609LA feature comparison

5962-89841013X QP Semiconductor

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5962-8872609LA QP Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC QP SEMICONDUCTOR INC
Package Description QCCN, DIP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; SHARED INPUT/CLOCK
Clock Frequency-Max 22 MHz 50 MHz
JESD-30 Code S-CQCC-N28 R-GDIP-T24
Length 11.43 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 28 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL REGISTERED
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Programmable Logic Type EE PLD UV PLD
Propagation Delay 30 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position QUAD DUAL
Width 11.43 mm
Base Number Matches 5 3
Part Package Code DIP
Pin Count 24
JESD-609 Code e0
Screening Level MIL-PRF-38535
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Terminal Finish TIN LEAD

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Compare 5962-8872609LA with alternatives