5962-89841013A
vs
5962H9475403QLA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
QLCC
|
|
| Package Description |
CERAMIC, LCC-28
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.1.A
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
22 MHz
|
33 MHz
|
| JESD-30 Code |
S-CQCC-N28
|
R-XDIP-T24
|
| JESD-609 Code |
e0
|
|
| Number of Dedicated Inputs |
11
|
|
| Number of I/O Lines |
10
|
|
| Number of Inputs |
22
|
22
|
| Number of Outputs |
10
|
10
|
| Number of Product Terms |
132
|
132
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
11 DEDICATED INPUTS, 10 I/O
|
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC28,.45SQ
|
DIP24,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Programmable Logic Type |
EE PLD
|
OT PLD
|
| Propagation Delay |
30 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
38535Q/M;38534H;883B
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
6
|
4
|
| Total Dose |
|
1M Rad(Si) V
|
|
|
|
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