5962-89839132X vs 5962H9475403QLA feature comparison

5962-89839132X QP Semiconductor

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5962H9475403QLA Cobham Semiconductor Solutions

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC AEROFLEX COLORADO SPRINGS
Part Package Code QLCC DIP
Package Description QCCN, DIP,
Pin Count 20 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.1.A
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-CQCC-N20 R-GDIP-T24
Number of Dedicated Inputs 8 11
Number of I/O Lines 8 10
Number of Terminals 20 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8 DEDICATED INPUTS, 8 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Programmable Logic Type EE PLD OT PLD
Propagation Delay 15 ns 20 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-PRF-38535 Class Q
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position QUAD DUAL
Base Number Matches 1 1
Additional Feature 10 MACROCELLS
Clock Frequency-Max 32 MHz
JESD-609 Code e0
Length 30.48 mm
Package Equivalence Code DIP24,.3
Seated Height-Max 4.2164 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Total Dose 1M Rad(Si) V
Width 7.62 mm

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Compare 5962H9475403QLA with alternatives