5962-8983911RX
vs
GAL16V8B-10LJI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
DIP
QLCC
Package Description
DIP,
PLASTIC, LCC-20
Pin Count
20
20
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-GDIP-T20
S-PQCC-J20
JESD-609 Code
e0
e0
Number of Dedicated Inputs
8
8
Number of I/O Lines
8
8
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8 DEDICATED INPUTS, 8 I/O
8 DEDICATED INPUTS, 8 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP20,.3
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Position
DUAL
QUAD
Base Number Matches
3
1
Rohs Code
Additional Feature
REGISTER PRELOAD; POWER-UP RESET
Architecture
PAL-TYPE
Clock Frequency-Max
58.8 MHz
Length
8.9662 mm
Moisture Sensitivity Level
1
Number of Inputs
18
Number of Outputs
8
Number of Product Terms
64
Peak Reflow Temperature (Cel)
225
Seated Height-Max
4.57 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
8.9662 mm
Compare 5962-8983911RX with alternatives
Compare GAL16V8B-10LJI with alternatives