5962-8981503LB
vs
5962-8752902LX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
WAFERSCALE INTEGRATION INC
Part Package Code
DIP
Package Description
DIP,
0.300 INCH, WINDOWED, CERDIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
12 ns
35 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
31.877 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
2KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.12 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
5
I/O Type
COMMON
Output Characteristics
REGISTERED
Package Equivalence Code
DIP24,.3
Compare 5962-8981503LB with alternatives
Compare 5962-8752902LX with alternatives