5962-8981501LX vs 5962-8752902LX feature comparison

5962-8981501LX Military Specifications

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5962-8752902LX Waferscale Integration Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MILITARY SPECIFICATIONS WAFERSCALE INTEGRATION INC
Package Description DIP, 0.300 INCH, WINDOWED, CERDIP-24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 25 ns 35 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Memory Density 16384 bit 16384 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX8 2KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.12 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 5
I/O Type COMMON
JESD-609 Code e0
Length 31.877 mm
Output Characteristics REGISTERED
Package Equivalence Code DIP24,.3
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 5962-8981501LX with alternatives

Compare 5962-8752902LX with alternatives