5962-8981501LA
vs
5962-8873503LX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
WAFERSCALE INTEGRATION INC
Part Package Code
DIP
Package Description
DIP,
CERAMIC, DIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
kg CO2e/kg
12
Average Weight (mg)
5781.95
CO2e (mg)
69383.402
Category CO2 Kg
12
Compliance Temperature Grade
Military: -55C to +125C
Access Time-Max
15 ns
85 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
31.877 mm
Memory Density
16384 bit
4096 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
4
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
1KX4
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.12 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
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