5962-8981001PA
vs
HCNW4506
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
HEWLETT PACKARD CO
|
| Package Description |
HERMETIC SEALED, CERAMIC, DIP-8
|
400 MIL, WIDE BODY PKG
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
HIGH RELIABILITY
|
UL RECOGNIZED, VDE APPROVED
|
| Configuration |
COMPLEX
|
COMPLEX
|
| Current Transfer Ratio-Min |
300%
|
|
| Data Rate-Nom |
0.1 MBps
|
1 MBps
|
| Forward Current-Max |
0.01 A
|
0.025 A
|
| Forward Voltage-Max |
1.7 V
|
|
| Isolation Voltage-Max |
1500 V
|
5000 V
|
| JESD-609 Code |
e0
|
e0
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
|
| On-State Current-Max |
0.04 A
|
0.015 A
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.05 W
|
|
| Supply Voltage-Min |
2 V
|
4.5 V
|
| Surface Mount |
NO
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
5
|
4
|
|
|
|
Compare 5962-8981001PA with alternatives
Compare HCNW4506 with alternatives