5962-8979502QXX vs TC74ACT541FW-ELP feature comparison

5962-8979502QXX STMicroelectronics

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TC74ACT541FW-ELP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code DFP SOIC
Package Description FP-20 SOP, SOP20,.4
Pin Count 20 20
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family ACT ACT
JESD-30 Code R-XDFP-F20 R-PDSO-G20
Length 12.955 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DFP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE
Propagation Delay (tpd) 10 ns 9.5 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 2.16 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.115 mm
Base Number Matches 1 1
Additional Feature WITH DUAL OUTPUT ENABLE; 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME
Control Type ENABLE LOW
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code SOP20,.4
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 9.5 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 5962-8979502QXX with alternatives

Compare TC74ACT541FW-ELP with alternatives