5962-8978501PA
vs
HCPL-5731#200
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROPAC INDUSTRIES INC
|
AGILENT TECHNOLOGIES INC
|
Package Description |
HERMETIC SEALED, CERAMIC, DIP-8
|
HERMETIC SEALED, CERAMIC, DIP-8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8541.40.80.00
|
8541.40.80.00
|
Configuration |
SEPARATE, 2 CHANNELS
|
COMPLEX
|
Current Transfer Ratio-Min |
200%
|
200%
|
Forward Current-Max |
0.01 A
|
0.01 A
|
Isolation Voltage-Max |
500 V
|
1500 V
|
JESD-609 Code |
e0
|
e0
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Number of Elements |
2
|
2
|
Number of Functions |
2
|
2
|
On-State Current-Max |
0.04 A
|
0.04 A
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
Power Dissipation-Max |
0.05 W
|
0.05 W
|
Supply Voltage-Min |
2 V
|
2 V
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Base Number Matches |
5
|
4
|
Rohs Code |
|
No
|
Additional Feature |
|
OPEN COLLECTOR, HIGH RELIABILITY
|
Data Rate-Nom |
|
0.1 MBps
|
|
|
|
Compare 5962-8978501PA with alternatives
Compare HCPL-5731#200 with alternatives