5962-8971101LX vs TMC2023B2V feature comparison

5962-8971101LX LOGIC Devices Inc

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TMC2023B2V Raytheon Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC RAYTHEON SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Boundary Scan NO NO
Clock Frequency-Max 25 MHz 25 MHz
External Data Bus Width 7
JESD-30 Code R-CDIP-T24 R-GDIP-T24
Low Power Mode NO NO
Moisture Sensitivity Level 3
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Data Bus Width 7 7
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Supply Current-Max 55 mA 55 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR
Base Number Matches 1 4
Additional Feature 2 X 1 BIT DATA INPUT BUS; 2 X 1 BIT DATA OUTPUT BUS; OPTEMP SPECIFIED AS TC
JESD-609 Code e0
Terminal Finish TIN LEAD

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