5962-8970201EA
vs
HCTS112DMSH
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
7.62 mm
Base Number Matches
3
2
Rohs Code
Additional Feature
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.0048 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
42 ns
Propagation Delay (tpd)
53 ns
Screening Level
38535V;38534K;883S
Total Dose
1M Rad(Si) V
Compare 5962-8970201EA with alternatives
Compare HCTS112DMSH with alternatives