5962-8969604XC vs 5962-8601504XC feature comparison

5962-8969604XC Pyramid Semiconductor Corporation

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5962-8601504XC Micross Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PERFORMANCE SEMICONDUCTOR CORP AUSTIN SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 22 22
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Category CO2 Kg 12
Compliance Temperature Grade Military: -55C to +125C
Access Time-Max 20 ns 45 ns
JESD-30 Code R-XDIP-T22 R-CDIP-T22
JESD-609 Code e0 e4
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 64KX1 64KX1
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 3.89 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Length 27.94 mm
Number of Ports 1
Output Characteristics 3-STATE
Output Enable NO
Standby Voltage-Min 2 V

Compare 5962-8969604XC with alternatives

Compare 5962-8601504XC with alternatives