5962-8969604XA
vs
5962-8969604XC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PERFORMANCE SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP22,.3
DIP,
Pin Count
22
22
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
I/O Type
SEPARATE
JESD-30 Code
R-CDIP-T22
R-XDIP-T22
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
OTHER SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
22
22
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
64KX1
64KX1
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP22,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Standby Current-Max
0.0006 A
Standby Voltage-Min
2 V
Supply Current-Max
0.16 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Compare 5962-8969604XA with alternatives
Compare 5962-8969604XC with alternatives