5962-8969601XC
vs
5962-8969601XA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PERFORMANCE SEMICONDUCTOR CORP
MATRA DESIGN SEMICONDUCTOR
Package Description
,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
64KX1
64KX1
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb) - hot dipped
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
4
Rohs Code
I/O Type
SEPARATE
JESD-30 Code
R-XDIP-T22
Number of Terminals
22
Output Characteristics
3-STATE
Package Equivalence Code
DIP22,.3
Package Shape
RECTANGULAR
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.12 mA
Terminal Pitch
2.54 mm
Compare 5962-8969601XC with alternatives
Compare 5962-8969601XA with alternatives