5962-8969202YX vs MT5C6404C-55/883C feature comparison

5962-8969202YX Integrated Device Technology Inc

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MT5C6404C-55/883C Micross Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC AUSTIN SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP22,.3
Pin Count 22 22
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 55 ns
JESD-30 Code R-XDIP-T22 R-CDIP-T22
Length 27.559 mm 29.337 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883 Class C
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature BATTERY BACKUP; LOW POWER STANDBY
I/O Type COMMON
Number of Ports 1
Output Characteristics 3-STATE
Output Enable NO
Package Equivalence Code DIP22,.3
Standby Current-Max 0.005 A
Standby Voltage-Min 2 V
Supply Current-Max 0.09 mA

Compare 5962-8969202YX with alternatives

Compare MT5C6404C-55/883C with alternatives