5962-8969106XX
vs
P4C164-15CWMLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Package Description
,
DIP,
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
15 ns
Memory Density
262144 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
8192 words
Number of Words Code
32000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
DIP
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Position
QUAD
DUAL
Base Number Matches
2
1
Rohs Code
Part Package Code
DIP
Pin Count
28
Additional Feature
LG-MAX
JESD-30 Code
R-CDIP-T28
Length
37.846 mm
Package Shape
RECTANGULAR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.08 mm
Supply Current-Max
0.17 mA
Surface Mount
NO
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare 5962-8969106XX with alternatives
Compare P4C164-15CWMLF with alternatives