5962-8959834MYC vs EDI88130CS55NC feature comparison

5962-8959834MYC LOGIC Devices Inc

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EDI88130CS55NC Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LOGIC DEVICES INC MICROSEMI CORP
Part Package Code SOJ SOJ
Package Description SOJ, SOJ32,.44 CERAMIC, SOJ-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-XDSO-J32 R-CDSO-J32
JESD-609 Code e0
Length 21.01 mm 21.082 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code SOJ SOJ
Package Equivalence Code SOJ32,.44
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 4.19 mm 3.937 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.795 mm 11.05 mm
Base Number Matches 1 5
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare EDI88130CS55NC with alternatives