5962-8959834MXX vs EDI88130LPS55CM feature comparison

5962-8959834MXX Microsemi Corporation

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EDI88130LPS55CM Microsemi Corporation

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Transferred Transferred
MICROSEMI CORP MICROSEMI CORP
DIP DIP
DIP, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
32 32
unknown unknown
3A001.A.2.C 3A001.A.2.C
8542.32.00.41 8542.32.00.41
55 ns 55 ns
R-CDIP-T32 R-CDIP-T32
1048576 bit 1048576 bit
STANDARD SRAM STANDARD SRAM
8 8
1 1
32 32
131072 words 131072 words
128000 128000
ASYNCHRONOUS ASYNCHRONOUS
125 °C 125 °C
-55 °C -55 °C
128KX8 128KX8
CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
DIP DIP
RECTANGULAR RECTANGULAR
IN-LINE IN-LINE
PARALLEL PARALLEL
Not Qualified Not Qualified
MIL-STD-883 MIL-PRF-38535
5.5 V 5.5 V
4.5 V 4.5 V
5 V 5 V
NO NO
CMOS CMOS
MILITARY MILITARY
THROUGH-HOLE THROUGH-HOLE
DUAL DUAL
10.16 mm 10.16 mm
9 4
No
COMMON
3-STATE
DIP32,.6
NOT SPECIFIED
0.002 A
2 V
0.2 mA
2.54 mm
NOT SPECIFIED

Compare 5962-8959834MXX with alternatives

Compare EDI88130LPS55CM with alternatives