5962-8959829MZA vs EDI88128CS25TI feature comparison

5962-8959829MZA Micross Components

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EDI88128CS25TI Mercury Systems Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSS COMPONENTS MERCURY SYSTEMS INC
Part Package Code DIP
Package Description DIP-32 DIP,
Pin Count 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
I/O Type COMMON
JESD-30 Code R-CDIP-T32 R-CDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.8928 mm 3.937 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 9 5
Length 40.64 mm

Compare 5962-8959829MZA with alternatives

Compare EDI88128CS25TI with alternatives