5962-8959821MZX vs EDI88130LPS20TM feature comparison

5962-8959821MZX Microsemi Corporation

Buy Now

EDI88130LPS20TM Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DIP DIP
Package Description DIP, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 40.64 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-PRF-38535
Seated Height-Max 3.937 mm 3.937 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 13 4
Pbfree Code No
Rohs Code No
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP32,.4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.225 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare EDI88130LPS20TM with alternatives