5962-8959819MTX vs EDI88130CS35FM feature comparison

5962-8959819MTX QP Semiconductor

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EDI88130CS35FM Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
JESD-30 Code R-CDFP-F32 R-CDFP-F32
Length 20.828 mm 20.828 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.175 mm 2.9464 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.414 mm 10.414 mm
Base Number Matches 13 5
Pbfree Code No
Rohs Code No
Part Package Code DFP
Package Description CERAMIC, DFP-32
Pin Count 32
Additional Feature BATTERY BACKUP OPERATION
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-PRF-38535
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 5962-8959819MTX with alternatives

Compare EDI88130CS35FM with alternatives