5962-8956808QUC
vs
MMCP-67204FV-15-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ATMEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
Package Description
DIP,
0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28
Pin Count
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
15 ns
Cycle Time
25 ns
25 ns
JESD-30 Code
R-CDIP-T28
R-CDIP-T28
JESD-609 Code
e4
e0
Length
27.94 mm
27.94 mm
Memory Density
36864 bit
36864 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
3.94 mm
3.94 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
GOLD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Memory IC Type
OTHER FIFO
Package Equivalence Code
DIP28,.3
Standby Current-Max
0.005 A
Supply Current-Max
0.12 mA
Compare 5962-8956808QUC with alternatives
Compare MMCP-67204FV-15-E with alternatives