5962-8956806ZA
vs
5962-9071507MZA
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
TELEDYNE E2V (UK) LTD
|
| Package Description |
CERAMIC, CC-32
|
QCCN, LCC32,.45X.55
|
| Reach Compliance Code |
unknown
|
compliant
|
| Access Time-Max |
30 ns
|
20 ns
|
| Additional Feature |
RETRANSMIT
|
|
| Cycle Time |
40 ns
|
30 ns
|
| JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
36864 bit
|
36864 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
4KX9
|
4KX9
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Qualified
|
Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
QFJ
|
| Pin Count |
|
32
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Package Equivalence Code |
|
LCC32,.45X.55
|
| Standby Current-Max |
|
0.025 A
|
| Supply Current-Max |
|
0.2 mA
|
| Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare 5962-8956806ZA with alternatives
Compare 5962-9071507MZA with alternatives