5962-8956704ZA
vs
MM4J-67203V-50/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEMIC SEMICONDUCTORS
Part Package Code
QFJ
Package Description
QCCN,
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-30 Code
R-CQCC-N32
S-XQCC-N32
JESD-609 Code
e0
e0
Length
13.97 mm
Memory Density
18432 bit
18432 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX9
2KX9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
Base Number Matches
1
2
Rohs Code
Clock Frequency-Max (fCLK)
15.38 MHz
Memory IC Type
OTHER FIFO
Package Equivalence Code
LCC32,.42SQ,40
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.0002 A
Supply Current-Max
0.125 mA
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