5962-8950701CA
vs
MM74HC4066J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
NATIONAL SEMICONDUCTOR CORP
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max (Isup)
0.16 mA
0.08 mA
Supply Voltage-Nom (Vsup)
6 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Rohs Code
Length
19.43 mm
Normal Position
NO
Off-state Isolation-Nom
42 dB
On-state Resistance Match-Nom
10 Ω
On-state Resistance-Max (Ron)
170 Ω
Output
SEPARATE OUTPUT
Package Equivalence Code
DIP14,.3
Seated Height-Max
5.08 mm
Switch-off Time-Max
36 ns
Switch-on Time-Max
20 ns
Switching
MAKE-BEFORE-BREAK
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-8950701CA with alternatives
Compare MM74HC4066J with alternatives