5962-8944902XX
vs
MC68881RC16
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
QFP
|
|
| Package Description |
QFF,
|
PGA, PGA68,10X10
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
12 MHz
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
S-CQFP-F68
|
S-XPGA-P68
|
| Length |
24.08 mm
|
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
QFF
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
2.69 mm
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
FLAT
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Width |
24.08 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
PGA68,10X10
|
| Power Supplies |
|
5 V
|
| Supply Current-Max |
|
150 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare 5962-8944902XX with alternatives