5962-8875601MEA
vs
5962R9654901VXX
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
AEROFLEX COLORADO SPRINGS
|
| Package Description |
DIP-16
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ACT
|
ACT
|
| JESD-30 Code |
R-GDIP-T16
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
|
| Length |
19.43 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
8
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Propagation Delay (tpd) |
16 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
2.921 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
6.731 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
16
|
| Package Equivalence Code |
|
FL16,.3
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare 5962-8875601MEA with alternatives
Compare 5962R9654901VXX with alternatives