5962-8875501FX
vs
TC74ACT257F(TP1)
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
End Of Life
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Package Description
DFP,
0.300 INCH, PLASTIC, SOP-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
R-GDFP-F16
R-PDSO-G16
Length
9.6645 mm
10.3 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Propagation Delay (tpd)
11.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.032 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
6.604 mm
5.3 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Output Characteristics
3-STATE
Power Supply Current-Max (ICC)
0.08 mA
Terminal Finish
TIN LEAD
Compare 5962-8875501FX with alternatives
Compare TC74ACT257F(TP1) with alternatives