5962-8873906QX
vs
LMU08DMB45
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
LOGIC DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-40
|
DIP, DIP40,.6
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-GDIP-T40
|
R-CDIP-T40
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Data Bus Width |
16
|
16
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
38535Q/M;38534H;883B
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER
|
DSP PERIPHERAL, MULTIPLIER
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
2 X 8 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
| Clock Frequency-Max |
|
22.22 MHz
|
| JESD-609 Code |
|
e0
|
| Length |
|
50.8 mm
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
DIP40,.6
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Seated Height-Max |
|
4.953 mm
|
| Supply Current-Max |
|
24 mA
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
15.24 mm
|
|
|
|
Compare 5962-8873906QX with alternatives
Compare LMU08DMB45 with alternatives