5962-8873302YC
vs
TMC2210N0C3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
LOGIC DEVICES INC
TRW LSI PRODUCTS INC
Part Package Code
LCC
Package Description
QCCN, LCC68,.95SQ
DIP, DIP64,.9
Pin Count
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
Boundary Scan
NO
External Data Bus Width
16
JESD-30 Code
S-CQCC-N68
R-PDIP-T64
JESD-609 Code
e4
e0
Length
24.1935 mm
Low Power Mode
NO
Moisture Sensitivity Level
3
Number of Terminals
68
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
35
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
DIP
Package Equivalence Code
LCC68,.95SQ
DIP64,.9
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
3.048 mm
Supply Current-Max
25 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
GOLD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
24.1935 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
1
2
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