5962-8872502XA
vs
EDI81256C45LI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
MICROSEMI CORP
|
| Package Description |
QCCN, LCC28,.35X.55
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
45 ns
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-CQCC-N28
|
R-CQCC-N28
|
| JESD-609 Code |
e0
|
|
| Length |
13.97 mm
|
13.97 mm
|
| Memory Density |
262144 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
28
|
28
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
256KX1
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
|
| Package Equivalence Code |
LCC28,.35X.55
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
3.048 mm
|
3.048 mm
|
| Standby Current-Max |
0.02 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.12 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.89 mm
|
8.89 mm
|
| Base Number Matches |
7
|
3
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
28
|
|
|
|
Compare 5962-8872502XA with alternatives
Compare EDI81256C45LI with alternatives