5962-8870401EX
vs
5962F9655302QXA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
AEROFLEX COLORADO SPRINGS
Package Description
DIP,
DFP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
R-GDIP-T16
R-CDFP-F16
Length
19.43 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
Output Polarity
INVERTED
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Propagation Delay (tpd)
12 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.921 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
4
2
Part Package Code
DFP
Pin Count
16
JESD-609 Code
e0
Package Equivalence Code
FL16,.3
Screening Level
MIL-PRF-38535 Class Q
Terminal Finish
TIN LEAD
Total Dose
300k Rad(Si) V
Compare 5962-8870401EX with alternatives
Compare 5962F9655302QXA with alternatives