5962-8868902QX
vs
Z8530DMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP40,.6
Pin Count
40
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Boundary Scan
NO
NO
Communication Protocol
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC
Data Encoding/Decoding Method
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max
0.3125 MBps
0.125 MBps
External Data Bus Width
8
8
JESD-30 Code
R-GDIP-T40
R-CDIP-T40
Low Power Mode
NO
NO
Number of Serial I/Os
2
2
Number of Terminals
40
40
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
3
1
Rohs Code
No
Bus Compatibility
8080; Z80; 6800; 68000; MULTIBUS
Clock Frequency-Max
4 MHz
JESD-609 Code
e0
Length
52.324 mm
Number of DMA Channels
Number of I/O Lines
On Chip Data RAM Width
Package Equivalence Code
DIP40,.6
RAM (words)
0
Screening Level
MIL-STD-883 Class B (Modified)
Seated Height-Max
5.715 mm
Supply Current-Max
250 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare 5962-8868902QX with alternatives
Compare Z8530DMB with alternatives