5962-8866904XX
vs
5962-8956705XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
TEMIC SEMICONDUCTORS
Package Description
DIP,
0.300 INCH, THIN, CERAMIC, DIP-28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
40 ns
40 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
50 ns
50 ns
JESD-30 Code
R-GDIP-T28
R-XDIP-T28
Length
37.1475 mm
37.1475 mm
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX9
2KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.15 mA
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
6
3
Clock Frequency-Max (fCLK)
20 MHz
Package Equivalence Code
DIP28,.6
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.004 A
Compare 5962-8866904XX with alternatives
Compare 5962-8956705XX with alternatives