5962-8866904XA vs 5962-8866904YX feature comparison

5962-8866904XA QP Semiconductor

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5962-8866904YX Cypress Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC CYPRESS SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP28,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 40 ns 40 ns
Additional Feature RETRANSMIT
Cycle Time 50 ns 50 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0
Length 37.1475 mm
Memory Density 18432 bit 18432 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX9 2KX9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 7 4
Part Package Code DIP
Pin Count 28
Clock Frequency-Max (fCLK) 20 MHz
Memory IC Type OTHER FIFO
Package Equivalence Code DIP28,.3
Screening Level MIL-STD-883
Standby Current-Max 0.025 A
Supply Current-Max 0.15 mA

Compare 5962-8866904XA with alternatives

Compare 5962-8866904YX with alternatives