5962-8866207NX vs L7C199CMB20 feature comparison

5962-8866207NX QP Semiconductor

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L7C199CMB20 LOGIC Devices Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC LOGIC DEVICES INC
Package Description DIP, DIP, DIP28,.3
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code R-CDIP-T28 R-GDIP-T28
Length 37.0205 mm 36.83 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 9 1
Rohs Code No
Part Package Code DIP
Pin Count 28
Additional Feature AUTOMATIC POWER-DOWN; LOW POWER OPERATION; BATTERY BACKUP OPERATION
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP28,.3
Peak Reflow Temperature (Cel) 225
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.145 mA
Terminal Finish TIN LEAD

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