5962-8866203XA vs 71256S55DB feature comparison

5962-8866203XA Freescale Semiconductor

Buy Now

71256S55DB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, DIP28,.6 0.600 INCH, CERAMIC, DIP-28
Reach Compliance Code unknown not_compliant
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883 Class B
Standby Current-Max 0.02 A 0.02 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.15 mA 0.135 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 16 2
Pbfree Code No
Part Package Code CDIP
Pin Count 28
Manufacturer Package Code CD28
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Date Of Intro 1988-01-01
Length 37.211 mm
Number of Functions 1
Peak Reflow Temperature (Cel) 240
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 15.24 mm

Compare 71256S55DB with alternatives