5962-8866202XA vs P4C1256L-70DI feature comparison

5962-8866202XA Intel Corporation

Buy Now

P4C1256L-70DI Pyramid Semiconductor Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP PYRAMID SEMICONDUCTOR CORP
Package Description DIP-28 0.300 INCH, CERAMIC, DIP-28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0 e0
Length 37.211 mm 37.719 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 5.08 mm 5.715 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm 7.62 mm
Base Number Matches 14 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 28
Additional Feature LG-MAX

Compare 5962-8866202XA with alternatives

Compare P4C1256L-70DI with alternatives