5962-8863603LX
vs
AM27S37ADCB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP24,.3
Pin Count
24
24
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
300 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Memory Density
8192 bit
1048576 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
64000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
1KX8
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Current-Max
0.12 mA
0.185 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Rohs Code
JESD-609 Code
e0
Length
31.9405 mm
Package Equivalence Code
DIP24,.3
Seated Height-Max
5.08 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-8863603LX with alternatives
Compare AM27S37ADCB with alternatives