5962-8863601LA
vs
5962-8863605KX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DFP
Package Description
DIP,
DFP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
JESD-609 Code
e0
Length
31.877 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Access Time-Max
12 ns
Screening Level
MIL-STD-883
Supply Current-Max
0.12 mA
Compare 5962-8863601LA with alternatives
Compare 5962-8863605KX with alternatives