Findchips: Compare 5962-8858702XX vs P4C147-35CMB

5962-8858702XX vs P4C147-35CMB feature comparison

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Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	CYPRESS SEMICONDUCTOR CORP	PYRAMID SEMICONDUCTOR CORP
Part Package Code	DFP	DIP
Package Description	DFP,	DIP,
Pin Count	18	18
Reach Compliance Code	unknown	compliant
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.32.00.41	8542.32.00.41
Access Time-Max	35 ns	35 ns
Additional Feature	AUTOMATIC POWER-DOWN
JESD-30 Code	R-GDFP-F18	R-CDIP-T18
JESD-609 Code	e0	e0
Length	12.7 mm
Memory Density	4096 bit	4096 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
Memory Width	1	1
Number of Functions	1	1
Number of Terminals	18	18
Number of Words	4096 words	4096 words
Number of Words Code	4000	4000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	4KX1	4KX1
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
Package Code	DFP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.286 mm	5.08 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	FLAT	THROUGH-HOLE
Terminal Pitch	1.27 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	6.985 mm	7.62 mm
Base Number Matches	1	1
Pbfree Code		No
Rohs Code		No
Screening Level		MIL-STD-883 Class B
	Memory » SRAMs	Memory » SRAMs